oldskool wrote on 11.02.12 at 12:47:21:


Nope. With peltiers isn't so easy reach such temperatures as many of us are used to think. Peltiers efficiency is strictly dependent on the possibility to properly cool the hot side of the cell; the more you cool down the hot side, the more the cold side will reduce its temperature. So you need a good cooler.

Usually, the way to have the best efficiency from a peltier is to cool it....with water. In that case, you'd better to prepare the card for insulation.

I remember that gtxe already made a custom v56k waterblock, not sure but with good results

Just a quick sketch up of the card and what needs to be cooled.
the green is the pcb, the bright red is the HiNT chip, and the 4 squares are the GPU's.



The whole back of the card will be cooled.  One large block.  a large single piece of thermal tape will be used.

The one large sheet will touch every inch of the board and pull the heat off.

the chips themselves get hot. The back of the chips were probably getting hot from the lack of cooling on the top of them.

This rear block will take off any heat the top block will produce.  It will pull any heat off of every component that it touches.

Basic overall shape :





The blue outline that is the funny shape is the copper
the black outline is the overall card.
The copper is what needs to be touching the chips, so I will avoid all those red areas.
The plastic is thick enough to just mill out depressions for the components.
So the black plastic will cover the entire card
giving you the sleek appearance of a seamless block.
A copper plate that touches the HiNT chip, GPU's and Ram.
Then the black plastic is a much larger piece that covers most of the card.
Each block will be 19mm thick.
V5k6 card is 1.6mm thick, and 19mm of copper and plastic on each side

NitroX infinity wrote on 15.02.12 at 16:06:18:


Right

Here are the heights of the following chips:

HiNT: 0.047"
RAM: 0.043"
GPU: 0.087"

Since the RAM, and HiNT chips are pretty much the same height, I have to remove some material above the GPU
OR....
1mm thermal pad is the same height that makes up the difference (1.03mm to be exact).

So,

Option A:

Remove 0.5mm off of the copper above the GPU's and get 0.5mm thermal pads for the RAM and HiNT chips...

Opiton B:

Remove no copper, and get 1mm thermal pads for the RAM, and HiNT

Conclusion :

The GPU's are what requires the most cooling. The ram and HiNT are secondary.
Best contact with GPU's will be removing no copper.
and getting the thicker 1mm thermal pad.
The solution is option B.

Quote:


dyson hoover?

m14radu wrote on 19.02.12 at 08:58:37:


No news for now but soon
Thanks for your support Comisarul.
It will be an amazing project.
The two waterblocks could put on any Voodoo5 6000
About the logo :
- on front waterblock : "3dfx"
- on back waterblock : "Voodoo5 6000"

Any more news for us?? I'm dying to see that waterblock.